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HANDYLINK?
APPLICATION SPECIFICATION
6.3.2 Encapsulation
The next step after soldering is to pre-seal or encapsulate the back end of the connector and hold the wires in place using a silicone
sealant or a low-pressure Macro-melt polyamide adhesive molding. The sealant will prevent accidental shorting between adjacent
terminals and discourage intrusion of over-mold resin into the terminal and latch cavities. An illustration of the pre-seal coverage is
shown below. Care must be taken to ensure that no encapsulant enters the terminal or latch cavities.
Figure 7.
Encapsulated plug connector
An alternate method is to combine one or more molded ‘covers’ to block entire sections where void circuits are present, then use a
pre-seal or encapsulant to hold the wires separate. This is illustrated below.
Figure 8.
Covered and encapsulated plug connector
NOTE: The sealant or cover should enclose the cavities under the latches, whether or not wires are soldered to the latches. Omission
of this step would allow the final over-mold resin to extrude into cavities in the housing that could disable latch and terminal function.
15
REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
TITLE:
APPLICATION SPECIFICATION
HANDYLINK?I/O CONNECTOR SYSTEM
SHEET No.
15 of 27
DOCUMENT NUMBER:
SD-45560-001
CREATED / REVISED BY:
M. Simmel/D. Morgan
CHECKED BY:
M. Ibarra
APPROVED BY:
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
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